1. 2. 3. material content data sheet sales product name ipd025n06n issued 29. august 2013 ma# MA000965714 package pg-to252-3-313 weight* 342.08 mg construction element material group substances cas# if applicable weight [mg] average mass [%] sum [%] average mass [ppm] sum [ppm] chip inorganic material silicon 7440-21-3 18.334 5.36 5.36 53594 53594 leadframe non noble metal iron 7439-89-6 0.166 0.05 487 inorganic material phosphorus 7723-14-0 0.050 0.01 146 non noble metal copper 7440-50-8 166.274 48.61 48.67 486062 486695 wire non noble metal aluminium 7429-90-5 4.562 1.33 1.33 13335 13335 encapsulation organic material carbon black 1333-86-4 1.201 0.35 3511 plastics epoxy resin - 21.021 6.15 61451 inorganic material silicondioxide 60676-86-0 97.900 28.62 35.12 286186 351148 leadfinish non noble metal tin 7440-31-5 3.740 1.09 1.09 10933 10933 plating inorganic material phosphorus 7723-14-0 0.003 0.00 10 non noble metal nickel 7440-02-0 1.421 0.42 0.42 4153 4163 solder non noble metal tin 7440-31-5 0.548 0.16 1603 noble metal silver 7440-22-4 0.685 0.20 2003 non noble metal lead 7439-92-1 26.178 7.65 8.01 76526 80132 *deviation < 10% sum in total: 100,00 1000000 important remarks: infineon technologies ag provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. infineon technologies ag and infineon technologies ag suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. all statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. company infineon technologies ag address 81726 mnchen internet www.infineon.com
|
